Packaging Engineer (CoWos) Job Listing at AMD in 新竹市 (Job ID 72605-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.  Together, we advance your career.  

THE ROLE:

Main role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements.

THE PERSON:

This individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly.

KEY RESPONSIBILITIES:

• Drive OSAT to develop advance assembly technology capabilities to meet technology development deliverables.
• Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs.
• Establish ecosystem partners to identify assembly capability improvement roadmap

PREFERRED EXPERIENCE:

• In depth process knowledge of key advanced packaging processes
• Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience.
• Well verse in typical technology development tools, FMEA, SPC, control plans, etc..
• Ability to communicate well in both English and Chinese language
  
  

ACADEMIC CREDENTIALS:

• Minimum MS degree in Mechanical or Material or Chemical Engineering 

LOCATION:

Hsinchu, Taiwan

• #LI-SC1

Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.